What Is High-Precision Wafer Dicing?

Silicon Wafer DicingOne of the most significant advances in electronics manufacturing is silicon wafer dicing. Wafers form the basis of semiconductors, microchips, and many electronic devices. To provide a general overview of the process, dicing involves high-speed saws that cut precise dies from the silicon wafer. The resulting dies are then placed in printed circuit boards or another electronic device.


Wafer dicing is an automation-focused process, as the cuts for wafers need to be made to exacting specifications. Many dies find purpose in computers, and also in sophisticated machinery used in the medical and defense industries.


One process, known as “high-precision wafer dicing,“ involves the cutting of silicon wafers to very small sizes. High-precision production methods can craft silicon dies for devices as little as 0.2mm. The wafers used in these manufacturing procedures can be as thin as 0.02mm


Silicon wafer dicing uses two machines to make die cuts. One method might utilize dual saw blades. Another might use a laser to etch out the dies. No matter the process, all steps must be overseen by computers to ensure accuracy and consistency. Another inspection crew conducts the final inspection to verify the dies. Diced wafers that do not pass inspection may be sent for reclaiming so that the materials can be used in another product.


Silicon wafer dicing utilizes advanced technology to create the innovations of tomorrow. Contact an experienced polishing company to learn about their dicing capabilities.