Wafer Reclaiming Services

Unlock significant cost savings through our specialized wafer reclaiming services. Since 1974, we’ve pioneered an advanced process for reclaiming reject wafers, allowing for multiple reclaim cycles. With the capability to supply several thousand wafers daily, our efficient turnaround time is typically just one day. We proudly ship worldwide, allowing you to experience the benefits of cost containment and centralized inventory control.

Technician inspecting silicon wafer in cleanroom.

Our commitment extends beyond wafer reclaiming. Explore our advanced silicon wafer polishing services, enhancing the quality and performance of your reclaimed wafers. Additionally, we offer precision wafer dicing services tailored to your specific requirements.

Our Typical Wafer Strip and Reclaim Procedures

Step 1: Receiving

We pick up wafers from customers.

Step 2: Incoming Inspection

We count wafers, and a report of “Wafer Conditions Before Process” is sent.

Step 3: Presort

Wafers are sorted for film removal.
Stripping schedules are designed for multilayered wafers.
Wafers are sorted into thickness groups.

Step 4: Strip & Etch

Chemical processing removes all existing patterns and films.

Step 5: In-Process Quality Assurance

Wafers are inspected and sorted.

Step 6: Polishing

We use state-of-the-art equipment to polish wafers with a prime test wafer surface. We ensure surface specs. Only a few microns are removed by our low-removal polishing technology.

Step 7: SC1/SC2

Clean Spin/Rinse/Dry Wafers are cleaned by the SC1 or SC2 process.
Particles are removed.

Step 8: Visual Inspection

100% visual inspection of wafers.

Step 9: Final Inspection

Wafers are inspected by KLA 6400 to ensure particle count per specification.

Step 10: Final Quality Assurance

Sort wafers.
Provide specified readouts.
Wafers are inspected, vacuum-packed, and delivered—often in the same workday.

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